STATS ChipPAC Ltd

(SCIPF)

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Profile

STATS ChipPAC Ltd is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. Its technology portfolio includes leadframe and laminate packages, fan-out and fan-in wafer level technology (FIWLP), flip chip interconnect and system-in-package (SiP). STATS ChipPAC markets its services through its direct sales force in the United States, Singapore, South Korea, China, Taiwan, and Switzerland. Revenue is derived primarily from wafer probe and bumping, packaging, and testing of semiconductor integrated circuits.

Contact Information

Website: www.statschippac.com
Main Phone: +65 68247777
Address: 10 Ang Mo Kio Street 65
Address 2: Techpoint No. 04-08/09
City / Town: Singapore
Country: SGP
Postal Code: 569059

Issuer Information

Exchange: GREY
Employees: 11179
NAICS: Semiconductor and Related Device Manufacturing(334413)


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Profile

STATS ChipPAC Ltd is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. Its technology portfolio includes leadframe and laminate packages, fan-out and fan-in wafer level technology (FIWLP), flip chip interconnect and system-in-package (SiP). STATS ChipPAC markets its services through its direct sales force in the United States, Singapore, South Korea, China, Taiwan, and Switzerland. Revenue is derived primarily from wafer probe and bumping, packaging, and testing of semiconductor integrated circuits.

Contact Information

Website: www.statschippac.com
Main Phone: +65 68247777
Address: 10 Ang Mo Kio Street 65
Address 2: Techpoint No. 04-08/09
City / Town: Singapore
Country: SGP
Postal Code: 569059

Issuer Information

Exchange: GREY
Employees: 11179
NAICS: Semiconductor and Related Device Manufacturing(334413)
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Last Trade Volume 0 52 Wk Hi N/A 52 Wk Low N/A
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Shares 2,394,948,293.00 EPS (TTM) -0.03 PE Ratio N/A Exchange Greys